Detailed Information of potting compounds

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Any device when invented is always required to be kept safely. There are many ways to safeguard a device but there is always a best way to safeguard them. The choosing of the right and the best safety packaging will lead to the better future use of that device. If safety is more important for an ordinary device then, microelectronic devices are no exception. The microelectronic devoices are more used in the form of commercial applications. When they are being used for these kinds of commercial applications they have to be encased within any kind of packaging material. This packaging material is called as the potting compound which acts as a glob top for the micro electronic device.

This potting compound functions as a molding compound and it essentially has two components encompassed within it. They are 1) the resin and 2) the hardener. The hardener may also be termed as an accelerator. These two components are mixed together in an appropriate ratio and they are then de-aired before they could be used in the application. This de-airing reduces the pressure of the compound.

Encapsulants are the other name for the Potting compounds. Epoxy, silicone, polyurethane and thermal potting compound are some of the types of the Potting compounds. Acrylic potting compounds are UV and heat materials which are used for hardening, Polyester and hot melt potting compounds are also some of the other types of the Potting compounds. There are some important features which make up the potting compounds. The potting compounds have a low viscosity. The pot life of the potting compounds is high at the application temperature level. They have a better level of adhesion and have a very good compatibility with the surface of the substrates. There are occurrences when there is filler settling, but these potting compounds have the resistance to the same.

The potting requires a low level of stress for substrates which have a ceramic base in them. The potting compounds also have a reasonable thermal stability which also is a primary requirement for this compound and its applications. Lastly they do have a very good electrical insulating property which also is required primarily.

The first component of the potting compound called as the resin which is got from the coniferous tree. These trees and plants secrete a hydrocarbon which may be used as a resin in the potting compounds. There is also the use of synthetic resin also. These resins are prepared by the well known chemical process - esterification. This process is through the soapy organic compounds. Epoxy resin is also a kind of resin, it is found that this resin is twice harder than cement and is waterproof. The appropriate resin must be selected according to the requirements.


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Soniya Gurg writes content about Adhesive manufacturer, Contract manufacturing, Toll Manufacturing, potting compounds and Assembly adhesives. For more information visit at: http://www.keypolymer.com/.

 

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